PDS



Trademark Coverage

No Class Specified

Specialized semi-conductor wafer-handling materials solution composed of organic and ceramic powder for use in back-grinding wafers and the application and removal of subsystems in connection therewith

Owner
Timeline
  • Jun 14
    2013
    Cancelled SEC 8 (6 Yr)
  • Nov 10
    2009
    TEAS Change Of Correspondence Received
  • Nov 07
    2006
    Registered Principal Register
  • Aug 22
    2006
    Published For Opposition
  • Aug 02
    2006
    Notice Of Publication
  • Jun 27
    2006
    Law Office Publication Review Completed
  • Jun 23
    2006
    Assigned To LIE
  • Jun 22
    2006
    Approved For PUB Principal Register
  • Jun 22
    2006
    Examiner's Amendment Entered
  • Jun 22
    2006
    Examiners Amendment E Mailed
  • Jun 22
    2006
    Examiners Amendment Written
  • Jun 07
    2006
    TEAS/Email Correspondence Entered
  • Jun 02
    2006
    Correspondence Received In Law Office
  • Jun 02
    2006
    TEAS Response To Office Action Received
  • May 25
    2006
    TEAS/Email Correspondence Entered
  • May 19
    2006
    Correspondence Received In Law Office
  • May 19
    2006
    TEAS Response To Office Action Received
  • May 19
    2006
    Petition To Revive Granted
  • May 19
    2006
    TEAS Petition To Revive Received
  • Apr 03
    2006
    Abandonment Notice Mailed Failure To Respond
  • Mar 31
    2006
    Abandonment Failure To Respond Or Late Response
  • Aug 19
    2005
    Non Final Action E Mailed
  • Aug 19
    2005
    Non Final Action Written
  • Aug 06
    2005
    Assigned To Examiner
  • Jan 18
    2005
    New Application Entered In TRAM