MICROFILL



Trademark Coverage

No Class Specified

Plating composition materials, namely electroplating compositions and components thereof that are suitable for plating electronic packaging components, namely, printed circuit boards and microelectronic wafers

Owners
Timeline
  • Aug 02
    2013
    Notice Of Acceptance Of SEC 8 & 9 E Mailed
  • Aug 02
    2013
    Registered And Renewed (First Renewal 10 Yrs)
  • Aug 02
    2013
    Registered SEC 8 (10 Yr) ACCEPTED/SEC 9 Granted
  • Aug 02
    2013
    Case Assigned To Post Registration Paralegal
  • Jul 18
    2013
    TEAS Section 8 & 9 Received
  • Oct 06
    2009
    Registered SEC 8 (6 Yr) Accepted & SEC 15 ACK
  • Oct 06
    2009
    Case Assigned To Post Registration Paralegal
  • Sep 22
    2009
    TEAS Section 8 & 15 Received
  • Jun 06
    2007
    Assignment Of Ownership Not Updated Automatically
  • Sep 14
    2006
    Review Of Correspondence Complete
  • Sep 27
    2004
    Paper Received
  • Feb 17
    2004
    TEAS Change Of Correspondence Received
  • Sep 23
    2003
    Registered Principal Register
  • Jul 28
    2003
    TEAS Extension Received
  • Jul 25
    2003
    Allowed Principal Register SOU Accepted
  • Jul 25
    2003
    Assigned To Examiner
  • Jul 24
    2003
    Case File In TICRS
  • Jul 09
    2003
    Statement Of Use Processing Complete
  • Jun 19
    2003
    Use Amendment Filed
  • Jun 19
    2003
    TEAS Statement Of Use Received
  • Jan 28
    2003
    NOA Mailed SOU Required From Applicant
  • Aug 28
    2002
    Correspondence Received In Law Office
  • Oct 22
    2002
    Published For Opposition
  • Oct 02
    2002
    Notice Of Publication
  • Aug 28
    2002
    Paper Received
  • Aug 07
    2002
    Approved For PUB Principal Register
  • Jun 25
    2002
    Correspondence Received In Law Office
  • Jun 25
    2002
    Paper Received
  • Jun 17
    2002
    Non Final Action Mailed
  • Jun 14
    2002
    Assigned To Examiner